Head of Product Development Engineering

Head of Product Development Engineering

Summary:

The Head of Product Development Engineering will be responsible for taking Ethernovia’s products from NPI to HVM. 

This position requires a leader who is hands-on with semiconductor product development. You will bridge the gap between world-class networking chip designs and high-volume, automotive-grade silicon manufacturing. The position is based in San Jose, CA.

Key Responsibilities:

• End-to-end product test and hardware ownership from pre-silicon to post-silicon, working with Arch, Design, SW/FW, DFT, System, Test (ATE/BI/SLT) and Q&R.
• Execute NPI bring-up for high-speed Ethernet switch and PHY products ensuring signal integrity and power/performance standards are maintained at scale.
• Drive the execution of the manufacturing flow from wafer starts to sample delivery. Own test strategy across wafer test, final test and system level test.
• Own characterization, ATE to system correlation, productization and manufacturing specs and margins (transistor to pmic, part to part, aging and grr)
• Own yield improvement across process/package/test, drive test time and test cost reduction, while maintaining and meeting automotive quality requirements.
  
  

Required Experience & Skills:

Professional Background

• Bachelor's or Master's degree in Electrical Engineering or a related technical field
• 12+ years of experience in fabless semiconductor operations, specifically for complex, high-performance SOCs or networking ICs.
• Must have direct experience with ATE and SLT testing, characterization, ATE to system correlation, productization and silicon/package qualification. 
• Must have direct experience working with foundries, assembly houses, test houses, and OSATs in the development of high-volume products from NPI through HVM.
• Expertise with iJTAG, Scan, MBIST, Sensor, SerDes, LSIO/HSIO testing on ATE, bare-metal, functional DVFS and benchmark testing at SLT and security fusing.
• Experience productizing high-speed communications chips using ATE and System characterization and correlation data, balancing PPY (power/perf/yield)
• Experience navigating the Automotive electronics ecosystem, including IATF 16949, ISO 26262, Safe launch and PPAP (Production Part Approval Process).
• Experience working in fast paced start-up environment building cutting edge products.

Technical Leadership & Skills:

• Understanding of high-bandwidth data-path products (Ethernet, Switching, or high-speed SerDes).
• Expert level experience with yield management systems, data analysis, scripting tools, and statistical data analysis using JMP.
• Understanding of product life cycle from concept to end of life and leading pre-silicon review and readiness to enable seamless post-silicon bring-up 

Nice to Have (The "Competitive Advantage"):

• Familiarity with their latest FinFET process node, and QFN, LGA/BGA assembly process for automotive products.
• Experience delivering high speed SerDes products to Tier-1 automotive OEMs.
• Experience managing contractors and leadership experience.

What You Can Expect From Ethernovia:

• Technology depth and breadth expansion that can’t be found in a large company
• Opportunity to grow your career as the company grows
• Pre IPO stock options
• Cutting edge technology
• World class team
• Competitive base salary
• Flexible hours
• Medical, dental and vision insurance for employees

Salary Range:

• The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $220,000 - $280,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, in addition to base salary and a full range of medical and other benefits.

* Principals Only (No Agencies)

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